Dynex DX-ESATAP Spezifikationen PDF herunterladen (Seite 16)

16

Specifications

Specifications

Chipset

Silicon Image 3132

Interface

One-lane PCI Express bus

Power port

External: 2 × Ø1.3 DC Jack

Internal

1 × 4-pin power connector

System

environment

Operating temperature: 41°F~104°F (5°C~40°C)

Operating humidity: 20%~80% RH

System

requirements

Windows XP, Windows Vista, Windows 7, Mac 10.4.x

or higher

Certification

FCC Class B, ICES-003

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